发明名称 |
SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND ASSOCIATED SYSTEMS, DEVICES, AND METHODS |
摘要 |
Methods for making semiconductor devices are disclosed herein. A method configured in accordance with a particular embodiment includes forming a spacer material on an encapsulant such that the encapsulant separates the spacer material from an active surface of a semiconductor device and at least one interconnect projecting away from the active surface. The method further includes molding the encapsulant such that at least a portion of the interconnect extends through the encapsulant and into the spacer material. The interconnect can include a contact surface that is substantially co-planar with the active surface of the semiconductor device for providing an electrical connection with the semiconductor device. |
申请公布号 |
KR20150104186(A) |
申请公布日期 |
2015.09.14 |
申请号 |
KR20157021305 |
申请日期 |
2014.01.10 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
YOO CHAN;BOLKEN TODD O. |
分类号 |
H01L25/10;H01L21/56;H01L21/82;H01L23/00;H01L23/28;H01L23/31;H01L23/495;H01L25/065 |
主分类号 |
H01L25/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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