PRODUCTION OF OPTOELECTRONIC COMPONENTS

摘要

The invention relates to a method for the production of optoelectronic components. The method comprises: the provision of a carrier; the arrangement of optoelectronic semiconductor chips on said carrier; and the formation of a conversion layer for converting radiation on the carrier, the optoelectronic semiconductor chips being surrounded by the conversion layer. Also disclosed is the carrying out of a separation process for forming separate optoelectronic components, wherein at least the conversion layer is cut through. The invention further relates to an optoelectronic component.