发明名称 LIGHT EMITTING DEVICE PACKAGE HAVING PHOSPHOR LAYER AND METHOD FOR FABRICATING THE SAME
摘要 The present invention relates to a light emitting device package having a phosphor layer, and manufacturing method thereof. A substrate having a wiring pattern is arranged. A light emitting device embedded in the substrate of the package is arranged. The light emitting device has a main body having a phosphor layer inside. The light emitting device has an upper electrode on the upper surface of the main body. A bonding wire is connected to the upper electrode, and the wiring pattern. The phosphor layer is formed on the light emitting device. The phosphor layer has a recess space for storing the upper electrode, and the bonding wire. The phosphor layer covers a side surface of the light emitting device.
申请公布号 KR20150103562(A) 申请公布日期 2015.09.11
申请号 KR20140025151 申请日期 2014.03.03
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 HONG, SUNG YONG;KIM, KYUNG TAE;PARK, HYUNG JIN;PARK, HEE SEOK;WANG, JI SEOK
分类号 H01L33/50 主分类号 H01L33/50
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