| 发明名称 |
UNDERFILL COMPOSITION FOR ENCAPSULATING A BOND LINE |
| 摘要 |
An underfill composition for encapsulating a bond line and a method of using the underfill composition are described. Advantageously, the disclosed underfill composition in an uncured state has a fluidity value of less than about ten minutes over about a two centimeter distance at a temperature of about 90 degrees C. and at a bond line thickness of about 50 microns or less and still have a bulk thermal conductivity that is greater than about 0.8 W/mK in the cured state. |
| 申请公布号 |
US2015252217(A1) |
申请公布日期 |
2015.09.10 |
| 申请号 |
US201414196581 |
申请日期 |
2014.03.04 |
| 申请人 |
NAMICS CORPORATION |
发明人 |
CZUBAROW Pawel;SATO Toshiyuki;MASUKO Tsutomu |
| 分类号 |
C09D163/00;H01L23/00;H01L21/56;H01L23/29;C08K3/28;C08K3/04 |
主分类号 |
C09D163/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An underfill composition for encapsulating a bond line having a thickness of about 50 microns or less, comprising:
an epoxy resin; a curing agent; and a plurality of filler particles, wherein the filler particles have a maximum particle size of about 3 microns, a bimodal or trimodal particle size distribution, and have an aspect ratio of about one, wherein the underfill composition in an uncured state has a fluidity value that is less than about ten minutes over about a two centimeter distance at a temperature of about 90 degrees C. within a bond line having a thickness of about 50 microns, and wherein the underfill composition in a cured state has a bulk thermal conductivity that is greater than about 0.8 W/mK. |
| 地址 |
Niigata-shi JP |
