发明名称 |
HONEYCOMB STRUCTURE |
摘要 |
There is provided a honeycomb structure where a crack at a honeycomb substrate is reduced. A honeycomb structure has a honeycomb substrate that has a porous partition wall defining a plurality of cells extending from an inflow end face as one end face to an outflow end face as another end face and becoming channels for a fluid, and an outer circumference coating layer disposed at an outer circumference of the honeycomb substrate . At 25 to 800° C., a thermal expansion coefficient of the outer circumference coating layer is larger than a thermal expansion coefficient of the honeycomb substrate. The thermal expansion coefficients of the outer circumference coating layer and the thermal expansion coefficient at 25 to 800° C. preferably meet a relationship represented by the expression: 1.1<(the thermal expansion coefficient of the outer circumference coating layer/the thermal expansion coefficient of the honeycomb substrate)<40. |
申请公布号 |
US2015252702(A1) |
申请公布日期 |
2015.09.10 |
申请号 |
US201514633612 |
申请日期 |
2015.02.27 |
申请人 |
NGK Insulators, Ltd. |
发明人 |
ITO Mitsuhiro |
分类号 |
F01N3/022;C04B38/00;B01D46/24;B32B3/12;B32B18/00 |
主分类号 |
F01N3/022 |
代理机构 |
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代理人 |
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主权项 |
1. A honeycomb structure, comprising:
a honeycomb substrate that has a porous partition wall defining a plurality of cells, the cells extending from an inflow end face as one end face to an outflow end face as another end face and becoming channels for a fluid; and an outer circumference coating layer disposed on an outer circumference of the honeycomb substrate, wherein at 25 to 800° C., a thermal expansion coefficient of the outer circumference coating layer is larger than a thermal expansion coefficient of the honeycomb substrate. |
地址 |
Nagoya-City JP |