发明名称 HONEYCOMB STRUCTURE
摘要 There is provided a honeycomb structure where a crack at a honeycomb substrate is reduced. A honeycomb structure has a honeycomb substrate that has a porous partition wall defining a plurality of cells extending from an inflow end face as one end face to an outflow end face as another end face and becoming channels for a fluid, and an outer circumference coating layer disposed at an outer circumference of the honeycomb substrate . At 25 to 800° C., a thermal expansion coefficient of the outer circumference coating layer is larger than a thermal expansion coefficient of the honeycomb substrate. The thermal expansion coefficients of the outer circumference coating layer and the thermal expansion coefficient at 25 to 800° C. preferably meet a relationship represented by the expression: 1.1<(the thermal expansion coefficient of the outer circumference coating layer/the thermal expansion coefficient of the honeycomb substrate)<40.
申请公布号 US2015252702(A1) 申请公布日期 2015.09.10
申请号 US201514633612 申请日期 2015.02.27
申请人 NGK Insulators, Ltd. 发明人 ITO Mitsuhiro
分类号 F01N3/022;C04B38/00;B01D46/24;B32B3/12;B32B18/00 主分类号 F01N3/022
代理机构 代理人
主权项 1. A honeycomb structure, comprising: a honeycomb substrate that has a porous partition wall defining a plurality of cells, the cells extending from an inflow end face as one end face to an outflow end face as another end face and becoming channels for a fluid; and an outer circumference coating layer disposed on an outer circumference of the honeycomb substrate, wherein at 25 to 800° C., a thermal expansion coefficient of the outer circumference coating layer is larger than a thermal expansion coefficient of the honeycomb substrate.
地址 Nagoya-City JP