| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a liquid ejection head achieving a reduction in size and a reduction in costs and being capable of easily and highly reliably bonding a flexible wiring board and a head substrate together, and further to provide a liquid ejection device.SOLUTION: A liquid ejection head comprises: a head unit 2 comprising a head main body ejecting ink, a flow passage formation member having an introduction port 44a introduced with the ink supplied to the head main body and a wiring board electrically connected to the head main body; a head substrate 300 having a first terminal row 310 electrically connected to the wiring board; and a downstream flow passage member having a first flow-in port 610 communicating with the introduction port 44a of the head unit 2. As viewed in a plan view, the introduction port 44a of the head unit 2 is disposed so as to overlap with the first terminal row 310 of the head substrate 300, and the first flow-in port 610 is disposed so as not to overlap with the first terminal row 310.</p> |
