| 摘要 |
According to one embodiment, an electronic device includes a substrate, a semiconductor chip, a resin material, a housing, and an adhesive member. The semiconductor chip is provided on the substrate. The resin material covers the semiconductor chip and contacts the substrate. The housing includes a first recess portion in which at least the resin material is accommodated, a second recess portion provided in the second recess portion, a third recess portion provided in the second recess portion, and a projection provided in the periphery of the third recess portion. The adhesive member is provided at least in the first recess portion to bond the housing and the resin material to each other. |
| 主权项 |
1. An electronic device comprising:
a substrate; a semiconductor chip provided on the substrate; a resin material covering the semiconductor chip and contacting the substrate; a housing, the housing comprising a first recess portion in which at least the resin material is accommodated, a second recess portion provided in the first recess portion, a third recess portion provided in the second recess portion, and a projection provided in a periphery of the third recess portion; an adhesive member provided at least in the first recess portion, the adhesive member bonding the housing and the resin material to each other. |
