PACKAGING FOR ELECTRONICS IN DOWNHOLE ASSEMBLIES

摘要

A downhole device configured to be inserted into a borehole includes a device body having an outer surface and a recess formed in the outer surface and a cover covering the recess to form a first cavity, the cover forming a fluid-tight seal with the device body. The device includes at least one shock-absorber configured to support an electrical module within the first cavity, the at least one shock-absorber extending between a base of the cavity and an inner surface of the cover opposite the base. The device also includes a vibration-damping layer located on at least one of the base of the cavity and the inner surface of the cover, the vibration-damping layer configured to be in contact with a surface of the electrical module to dampen vibration of the electrical module.

主权项

1. A downhole device configured to be inserted into a borehole, the downhole device comprising:
a device body having an outer surface and a recess formed in the outer surface; a cover covering the recess to form a first cavity, the cover forming a fluid-tight seal with the device body; at least one shock-absorber configured to support an electrical module within the first cavity, the at least one shock-absorber extending between a base of the cavity and an inner surface of the cover opposite the base; and a vibration-damping layer located on at least one of the base of the cavity and the inner surface of the cover, the vibration-damping layer configured to be in contact with a surface of the electrical module to dampen vibration of the electrical module.