发明名称 ULTRASOUND PROBE
摘要 An ultrasound probe which is connected to an ultrasound diagnosis apparatus includes an acoustic element for converting an electric signal and an ultrasound to each other, an electric signal processing circuit electrically connected to the acoustic element, a case for storing the acoustic element and the electric signal processing circuit, an acoustic element board for electrically connecting the acoustic element to the electric signal processing circuit, and a partition part which is arranged to contact with the case and separates the acoustic element and the electric signal processing circuit. A space on the side of the acoustic element in the case separated by the partition part is filled with a first material having lower thermal conductivity than that of a material for forming an inner wall surface of the case. Accordingly, the heat generated by a circuit unit such as the electric signal processing circuit can be more efficiently dissipated.
申请公布号 US2015253290(A1) 申请公布日期 2015.09.10
申请号 US201314437077 申请日期 2013.11.19
申请人 KONICA MINOLTA, INC. 发明人 Fujii Kiyoshi;Migita Manabu;Suginouchi Takehiko
分类号 G01N29/24 主分类号 G01N29/24
代理机构 代理人
主权项 1. An ultrasound probe for connecting to an ultrasound diagnosis apparatus, comprising: an acoustic element configured to convert an electric signal and an ultrasound to each other; an electric signal processing circuit configured to be electrically connected to the acoustic element; a case configured to store the acoustic element and the electric signal processing circuit; an acoustic element board configured to electrically connect the acoustic element to the electric signal processing circuit; and a partition part configured to be arranged so as to contact with the case and separate the acoustic element and the electric signal processing circuit, wherein a space on a side of the acoustic element in the case separated by the partition part is filled with a first material having lower thermal conductivity than that of a material for forming an inner wall surface of the case.
地址 Tokyo JP