发明名称 |
VTFT INCLUDING OVERLAPPING ELECTRODES |
摘要 |
A vertical transistor includes a substrate and an electrically conductive gate structure having a top surface and including a reentrant profile. A conformal electrically insulating layer that maintains the reentrant profile is in contact with the electrically conductive gate structure and at least a portion of the substrate. A conformal semiconductor layer that maintains the reentrant profile is in contact with the conformal electrically insulating layer. An electrode that extends into the reentrant profile is in contact with a first portion of the semiconductor layer. Another electrode is vertically spaced apart from the electrode, overlaps a portion of the electrode that extends into the reentrant profile, is in contact with a second portion of the semiconductor material layer over the top surface of the electrically conductive gate structure, and is within the reentrant profile. |
申请公布号 |
US2015255624(A1) |
申请公布日期 |
2015.09.10 |
申请号 |
US201414198643 |
申请日期 |
2014.03.06 |
申请人 |
Nelson Shelby Forrester;Ellinger Carolyn Rae;Tutt Lee William |
发明人 |
Nelson Shelby Forrester;Ellinger Carolyn Rae;Tutt Lee William |
分类号 |
H01L29/786;H01L29/10;H01L29/423 |
主分类号 |
H01L29/786 |
代理机构 |
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代理人 |
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主权项 |
1. A vertical transistor comprising:
a substrate; an electrically conductive gate structure including a reentrant profile, the electrically conductive gate structure having a top surface; a conformal electrically insulating layer that maintains the reentrant profile and is in contact with the electrically conductive gate structure and at least a portion of the substrate; a conformal semiconductor layer that maintains the reentrant profile and is in contact with the conformal electrically insulating layer; an electrode that extends into the reentrant profile and is in contact with a first portion of the semiconductor layer; and another electrode that is vertically spaced apart from the electrode, overlaps a portion of the electrode that extends into the reentrant profile, is in contact with a second portion of the semiconductor material layer over the top surface of the electrically conductive gate structure, and is within the reentrant profile. |
地址 |
Pittsford NY US |