| 摘要 |
A semiconductor package mounting structure includes a substrate (200) and a semiconductor package (100). The substrate (200) includes an opening (210) connected to a cavity of a waveguide (310). The semiconductor package (100) is mounted on the substrate (200). The semiconductor package (100) includes a semiconductor device (110) and a probe (152) connected to the semiconductor device (110). The opening (210) includes a part that overlaps the probe (152) and a part that does not overlap the semiconductor package (100). |
