摘要 |
<p>A copper alloy for an electric and electronic device includes more than 2.0 mass% to 36.5 mass% of Zn, 0.1 mass% to 0.9 mass% of Sn, 0.05 mass% to less than 1.0 mass% ofNi, 0.5 mass ppm to less than 10 mass ppm of Fe, 0.001 mass% to less than 0.10 mass% of Co, 0.001 mass% to 0.10 mass% of P, and a balance including Cu and unavoidable impurities, in which, ratios between the amounts of the respective elements satisfy 0.002‰¤Fe/Ni<1.5, 3<(Ni+Fe)/P<15, and 0.3<Sn/(Ni+Fe)<5 by atomic ratio, and the copper alloy includes a precipitate containing P and at least one element selected from the group consisting of Fe, Co and Ni.</p> |