发明名称 COPPER ALLOY FOR ELECTRONIC OR ELECTRICAL DEVICE, COPPER ALLOY THIN SHEET FOR ELECTRONIC OR ELECTRICAL DEVICE, PROCESS FOR MANUFACTURING COPPER ALLOY FOR ELECTRONIC OR ELECTRICAL DEVICE, CONDUCTIVE COMPONENT FOR ELECTRONIC OR ELECTRICAL DEVICE, AND TERMINAL
摘要 <p>A copper alloy for an electric and electronic device includes more than 2.0 mass% to 36.5 mass% of Zn, 0.1 mass% to 0.9 mass% of Sn, 0.05 mass% to less than 1.0 mass% ofNi, 0.5 mass ppm to less than 10 mass ppm of Fe, 0.001 mass% to less than 0.10 mass% of Co, 0.001 mass% to 0.10 mass% of P, and a balance including Cu and unavoidable impurities, in which, ratios between the amounts of the respective elements satisfy 0.002‰¤Fe/Ni<1.5, 3<(Ni+Fe)/P<15, and 0.3<Sn/(Ni+Fe)<5 by atomic ratio, and the copper alloy includes a precipitate containing P and at least one element selected from the group consisting of Fe, Co and Ni.</p>
申请公布号 KR20150103049(A) 申请公布日期 2015.09.09
申请号 KR20157018317 申请日期 2013.07.10
申请人 MITSUBISHI MATERIALS CORP.;MITSUBISHI SHINDOH CO., LTD. 发明人 MAKI KAZUNARI;MORI HIROYUKI;YAMASHITA DAIKI
分类号 C22C9/04;C22F1/08;C25D5/50;C25D7/06;H01B1/02 主分类号 C22C9/04
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