| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce the possibility of breakage of a ceramic substrate due to a difference in thermal expansion coefficient between the ceramic substrate and a metal plate. <P>SOLUTION: An upper end of each of a plurality of metal members 14a, 14b is joined to a first or second upper surface metal plate 12a, 12b. A lower end of each of the metal members 14a, 14b is joined to a lower surface metal plate 13. Each of the metal members 14a, 14b is arranged apart from an inner surface of a through hole 11a. The first and second upper surface metal plates 12a, 12b are electrically connected via the metal members 14a, 14b and the lower surface metal plate 13. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
