| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a separation device and a separation method that can improve processing capacity with a simple constitution. <P>SOLUTION: This separation device 1 includes a second sheet support means 2 having a first surface W1 stuck to one surface of a first adhesive sheet S1 and supported by a first ring frame RL1 as a frame member, having a second surface W2 for separating the first adhesive sheet S1 from a wafer W as a plate-like member stuck to one surface of a second adhesive sheet S2 and supporting the second adhesive sheet S2 by a support surface 21 contacting with the other surface side of the second adhesive sheet S2, a moving means 3 that can move the second sheet support means 2 in the parallel direction to the first surface W1 of the wafer W, a separation force imparting means 5 that can impart separation force in the direction for separating from the wafer W to the first adhesive sheet S1, and a collecting means 6 for collecting the wafer W of separating the first adhesive sheet S1. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
