| 发明名称 |
Radio frequency package on package circuit |
| 摘要 |
A radio frequency package on package (PoP) circuit is described. The radio frequency package on package (PoP) circuit includes a first radio frequency package. The first radio frequency package includes radio frequency components. The radio frequency package on package (PoP) circuit also includes a second radio frequency package. The second radio frequency package includes radio frequency components. The first radio frequency package and the second radio frequency package are in a vertical configuration. The radio frequency components on the first radio frequency package are designed to reduce the effects of ground inductance. |
| 申请公布号 |
US9131634(B2) |
申请公布日期 |
2015.09.08 |
| 申请号 |
US201213677054 |
申请日期 |
2012.11.14 |
| 申请人 |
QUALCOMM Incorporated |
发明人 |
Hadjichristos Aristotele;Sahota Gurkanwal Singh;Ciccarelli Steven C;Wilding David J;Lane Ryan D;Holenstein Christian;Shah Milind P |
| 分类号 |
H04B5/00;H05K3/36;H04B1/40;H05K13/04;H01L23/66;H01L25/16 |
主分类号 |
H04B5/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A radio frequency package on package circuit comprising:
a first radio frequency package comprising radio frequency components; and a second radio frequency package comprising radio frequency components, wherein the first radio frequency package and the second radio frequency package are in a vertical configuration with the first radio frequency package positioned on top of the second radio frequency package, and wherein the radio frequency components on the first radio frequency package are designed to compensate for the first radio frequency package experiencing greater ground inductance than the second radio frequency package. |
| 地址 |
San Diego CA US |
