Method of manufacturing semiconductor apparatus and semiconductor apparatus

摘要

A method of manufacturing a semiconductor apparatus includes: a charging step of charging the thermosetting resin in excess of an amount necessary for forming the sealing layer to fill the inside of the first cavity with the thermosetting resin and discharging an excess of the thermosetting resin from the first cavity; an integrating step of integrating the substrate on which the semiconductor device is mounted, the substrate on which no semiconductor device is mounted and the sealing layer by molding the thermosetting resin while pressurizing the upper mold and the lower mold; and a dicing step of extracting the integrated substrates from the molding mold and dicing the integrated substrates to obtain an individual semiconductor apparatus.

主权项

1. A method of manufacturing a semiconductor apparatus with a forming mold having an upper mold and a lower mold comprising:
a preparing step of preparing the forming mold having a first cavity for integrating a substrate on which a semiconductor device is mounted, a second cavity that is connected with the first cavity via a runner, a substrate on which no semiconductor device is mounted, and a sealing layer to be formed of a thermosetting resin between the substrates; an arranging step of heating the first cavity to a temperature ranging from a room temperature to 200° C., disposing the substrate on which the semiconductor device is mounted on one of the upper mold and the lower mold of the forming mold, and disposing the substrate on which no semiconductor device is mounted on the other of the upper mold and the lower mold; a charging step of charging the thermosetting resin in excess of an amount necessary for forming the sealing layer to fill the inside of the first cavity with the thermosetting resin and discharging an excess of the thermosetting resin from the first cavity into the second cavity; an integrating step of integrating the substrate on which the semiconductor device is mounted, the substrate on which no semiconductor device is mounted and the sealing layer by molding the thermosetting resin while pressurizing the upper mold and the lower mold; and a dicing step of extracting the integrated substrates from the molding mold and dicing the integrated substrates to obtain an individual semiconductor apparatus.