Semiconductor device and method for manufacturing the same

摘要

The present disclosure provides a semiconductor device, including a semiconductor substrate, an epitaxial structure, a well region, a drain region and a source region respectively formed in the epitaxial structure inside and outside of the well region. At least one set of first, second and third heavily doped regions formed in the well region between source and drain regions, wherein the first, second and third heavily doped regions are adjoined sequentially from bottom to top. A gate structure disposed over the epitaxial structure. The present disclosure also provides a method for manufacturing the semiconductor device.

主权项

1. A method for manufacturing a semiconductor device, comprising:
providing a semiconductor substrate having a first conductivity type; forming an epitaxial structure of the first conductivity type over the semiconductor substrate; forming a well region of a second conductivity type in the epitaxial structure and the semiconductor substrate, wherein the second conductivity type is opposite to the first conductivity type; forming at least one set of first, second and third heavily doped regions in the well region between source and drain regions, wherein the first, second and third heavily doped regions are adjoined sequentially from bottom to top and the second heavily doped region has a doping concentration greater than that of the well region, and the first and third heavily doped regions have a doping concentration similar to that of the well region, wherein the second heavily doped region has the first conductivity type, while the first and third heavily doped regions have the second conductivity type; forming a drain region and a source region respectively in the epitaxial structure inside and outside of the well region, such that the set of first, second and third heavily doped regions is disposed in the well region between the drain region and the source region; and forming a gate structure over the epitaxial structure.