Thermal package with heat slug for die stacks

摘要

A semiconductor assembly comprises a package, which in turn comprises at least one substrate, a first die stacked onto the substrate, at least one further die stacked onto the first die, at least one heat spreader in the package, and TSV:s extending through the stacked dies. The ends of the TSV:s are exposed at the further die.

主权项

1. A semiconductor assembly for operational connection to a printed wiring board (PWB) via electrical and thermal connections therebetween, the semiconductor assembly comprising:
a package, which in turn comprises: at least one substrate, a first die stacked onto the substrate, at least one further die stacked onto the first die, wherein at least one heat spreader is positioned on an upper die of the at least one further die, at least one of the heat spreader in the package, TSVs extending through the stacked dies, such that ends of the TSVs are exposed at the further die, wherein the exposed ends of the TSVs are in thermal contact with the heat spreader, and
wherein the at least one heat spreader positioned on the upper die is thermally connected to at least one TMV extending through the substrate down to the PWB, which TMV is thermally connected to the PWB for heat dissipation by means of the PWB acting as an additional heat spreader.