| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a device and a method for mounting an electronic component, capable of mounting an electronic component in a shorter time and improving productivity.SOLUTION: A device for mounting an electronic component comprises: a substrate transfer unit 12; an electronic component supply device 90; a head 15 which includes a head body 30 with a plurality of nozzles and a head support 31 and a head camera unit 35 with a plurality of head cameras 52 fixed to the head support 31 corresponding to the nozzles, and holds an electronic component by the nozzles, transfers the electronic component from the electronic component supply device to the substrate, and mounts the component on the substrate; a head movement mechanism 16 which moves the head; and a control device 20 including a camera control unit 214 which processes the image photographed by the head camera 52 and a head control unit 62 which controls the head operation. The camera control unit 214 generates an image linked with a visual field of the head camera by synthesizing by the images photographed by the plurality of head cameras 52. The control unit 20 determines processing on the basis of the images synthesized by the camera control unit 214.</p> |
