SEMICONDUCTOR CHIP AND SEMICONDUCTOR CHIP PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor chip.SOLUTION: A semiconductor chip is provided. The semiconductor chip includes: a first circuit; a second circuit; a third circuit; a first signal path; and a second signal path. The first circuit provides a reference signal. The first signal path has a first conductive trace and transmits the reference signal from the first circuit to the second circuit. The second signal path transmits the reference signal from the first circuit to the third circuit. The timing skew of the first signal path and the second signal path is in an equilibrium state. The first signal path and the second signal path are wholly communicated with each other.