发明名称 APPARATUS FOR GRINDING SIDE EDGE OF THIN PLATE WORK
摘要 <p>An apparatus for grinding a side edge of a thin plate material of the present invention includes: a polishing tape formed as a polishing material is attached to a strap-shaped material; an unwinder on which the polishing tape is wound; a rewinder on which the polishing tape released from the unwinder is rewound; a pair of support rollers which are arranged on the path where the polishing tape released from the unwinder is rewound around the rewinder, and supports the polishing tape; and a fixing unit which touches the polishing tape arranged between the support rollers, and fixes a thin plate material to be polished.</p>
申请公布号 KR20150101666(A) 申请公布日期 2015.09.04
申请号 KR20140023243 申请日期 2014.02.27
申请人 WISYS CO., LTD. 发明人 LEE, JUNG WOO;CHO, HEE JUONG;KANG, DONG SEONG
分类号 H01L21/304;B24B9/10;B24B21/16 主分类号 H01L21/304
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