PROCESSING METHOD, PROCESSING DEVICE, AND PRODUCT PRODUCED THEREBY

摘要

PROBLEM TO BE SOLVED: To provide a processing device which can efficiently conduct a process, such as polishing on even a highly rigid work piece, such as SiC, GaN or diamond.SOLUTION: A processing device comprises: a mechanically processing unit 12 which touches a work piece W, relatively moves with respect to the work piece W, and forms a process-affected layer on at least a part of the surface of the work piece W; a plasma generating unit 14 which is disposed adjacently to the mechanically processing unit 12 and causes plasma to chemically act on the surface of at least part of the process-affected layer formed by the mechanically processing unit 12 and thus, removes the at least part of the process-affected layer; a holding unit 17 for holding the work piece W; and a transporting mechanism 18 which transports the work piece W held by the holding unit 17 between the mechanically processing unit 12 and the plasma generating unit 14.