LIGHT EMITTING DEVICE PACKAGE

摘要

A light emitting device package according to a technical idea of the present invention is to includes a through electrode and to solve a step coverage problem caused by a deposition method when forming a through electrode insulating film on a substrate where the through electrode is formed, and to simplify a process by omitting an additional etching process of an insulating film by the deposition. The light emitting device package includes: a light emitting device; a first electrode pad, and a second electrode pad formed by being coupled to the bottom of the light emitting device; a joint insulating pattern layer formed to cover a part of the side and the bottom of the first electrode pad, and second electrode pad; a substrate on which a via hole penetrating from a first side coupled to the bottom of the joint insulating pattern layer to a second side, the opposite side; a through electrode which contacts the bottom of the first electrode pad and second electrode pad, and is formed inside of the via hole; and a through electrode insulating layer which is formed between the through electrode and substrate, and includes a through electrode insulating layer having the top in contact with a part of the bottom of the joint insulating pattern layer.