| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which the distance between an element formed on a surface of a semiconductor substrate and a circuit component is short and accordingly the electric resistance between them can be decreased.SOLUTION: A semiconductor chip 2 comprises: a semiconductor substrate 3; an element 101 formed in an element formation region 4 of a front surface 3a of the semiconductor substrate 3; and a through via 9 which avoids the element formation region 4 of the semiconductor substrate 3 and penetrates between the front surface 3a and a back surface 3b of the semiconductor substrate 3 and in which a conducting path 4 is formed between the front surface 3a and the back surface 3b. A semiconductor device 1 comprises: a semiconductor chip 2; circuit components C1, C2, and L mounted on a circuit component connection surface 10 that is a surface of the semiconductor chip 2 on the same side of the front surface 3a of the semiconductor substrate 3; and an external connection member 8 provided on the side of the back surface 3b of the semiconductor substrate 3. |
