发明名称 DIFFERENTIAL PRESSURE SENSING DIE
摘要 A differential pressure sensor includes a pressure sensing die comprising a semiconductor die, having a thinned portion forming a diaphragm. The diaphragm includes piezo-resistive elements that exhibit varying resistance based on force exerted on the diaphragm. A first support structure is bonded to a first surface of the semiconductor die, having an aperture defined through the support structure such that a first surface of the diaphragm is exposed through the aperture. A second support structure is bonded to the opposite side of the semiconductor die having an aperture aligned with the opposing side of the diaphragm. Electrical components in electrical communication with the piezo-resistive elements are arranged outside the region defined by the bond between the first and second support structures and the semiconductor die. An oil-filled volume may be defined between the semiconductor die and a harsh medium which transmits a fluid pressure to the die without the harsh medium contacting the die.
申请公布号 US2015247773(A1) 申请公布日期 2015.09.03
申请号 US201414193992 申请日期 2014.02.28
申请人 MEASUREMENT SPECIALTIES, INC. 发明人 Wagner David E.;Hoffman James H.;Jenni Kaspar L.
分类号 G01L9/00;G01L13/02 主分类号 G01L9/00
代理机构 代理人
主权项 1. A differential pressure sensing die for measuring the differential pressure between two isolated fluids, the differential pressure sensing die comprising: a semiconductor die having an upper surface and a lower surface, and having a first region at a first thickness, and a second region having a second thickness, the second thickness being less than the first thickness, the second region defining a diaphragm, the diaphragm having disposed thereon, at least one piezo-resistive element, the at least one piezo-resistive element exhibiting a varying resistance responsive to deflection of said diaphragm; a first support structure bonded to the upper surface of the semiconductor die, the first support structure having an aperture defined therethrough, the aperture adapted to expose the diaphragm through said first support structure and provide a seal with the upper surface of the first semiconductor die; and a second support structure bonded to the lower surface of the semiconductor die, the second support structure having an aperture defined therethrough, the aperture adapted to expose the diaphragm through said second support structure.
地址 HAMPTON VA US