| 摘要 |
<p>The present invention relates to a flip module and, more specifically, to a flip module of a thin film deposition system which flips a substrate for a deposition surface of the substrate toward the upper or lower direction depending on a process condition. The flip module of the thin film deposition system flipping a subject includes: a flip chamber which has a first gate through which a subject is introduced to the inside thereof and a second gate through which the subject is discharged to the outside thereof; a flip unit which is installed inside the flip chamber and reverses the subject; and a transfer unit which is installed inside the flip chamber, introduces the subject introduced through the first gate to the flip unit, and discharges the subject reversed by the flip unit through the second gate.</p> |
