| 摘要 |
Provided is an electrical connection structure for a plastic package type IPM. The structure uses a conducting film as a carrier of chips, so that a structure in which a lead frame is used as the carrier part is saved, thereby optimizing the design of the lead frame. In addition, a power chip (4) and a driving chip (6) are disposed at the same level on a lower-layer conducting film (3), thereby effectively reducing the distance between chips and facilitating electrical connection between an upper-layer conducting film (2) and the chips. The chips are adhered to the conducting film by using silver paste, so that process steps of welding the chips and bonding the leads are omitted and the production efficiency of the module can be effectively improved. Because the chips are in surface contact with the conducting film, the contact area is increased, the through-current capability, reliability, stability and safety of a product are ensured, and the quality and the service life of the module are improved. In addition, because the conducting film is made of a soft material, it is not required to design the lead frame as a bent structure, so that production cost of the whole module can be reduced. The conducting film is thin and has good heat dissipation performance. |
