VISCOUS FLUID COATING DEVICE

摘要

Solder is accommodated in a flow tank (20). The solder is discharged from a nozzle (22) by a pump provided in the flow tank (20). A jetting motor (26) for driving the pump is provided on the exterior of the flow tank (20). A cooling device (30) is provided between the flow tank (20) and the jetting motor (26). The cooling device (30) includes a zigzag-shaped cooling pipe (52). Nitrogen gas is supplied from the upstream end part of the cooling pipe (52), channeled along the cooling pipe (52), discharged from the downstream end part, and fed to the flow tank (20). Release of heat by the jetting motor (26) raises the temperature of the nitrogen gas and lowers the temperature of the jetting motor (26). Heat from the jetting motor (26) is transmitted to the nitrogen gas, and the jetting motor (26) can be satisfactorily cooled.