发明名称 ETCHING COMPOSITION, ETCHING METHOD EMPLOYING SAME, AND PRODUCTION METHOD FOR SEMICONDUCTOR SUBSTRATE PRODUCT
摘要 Provided is an etching method for a substrate in which a first material containing NiPt, and at least one element from among In, Al, Ga, Sb, and As, is present, the etching method involving application of an acidic etching composition containing halogen ions and nitric acid or nitrate ions to a substrate.
申请公布号 WO2015129552(A1) 申请公布日期 2015.09.03
申请号 WO2015JP54680 申请日期 2015.02.19
申请人 FUJIFILM CORPORATION 发明人 MIZUTANI, ATSUSHI
分类号 H01L21/308;C23F1/44;H01L21/336;H01L29/78 主分类号 H01L21/308
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