| 摘要 |
<p>A semiconductor device package (400) having a cavity (610, 1240) formed using film-assisted molding techniques is provided. Through the use of such techniques the cavity can be formed in specific locations in the molded package, such as on top of a device die (710) mounted on the package substrate or a lead frame (420, 1215). In order to overcome cavity wall angular limitations introduced by conformability issues associated with film-assisted molding, a gel reservoir feature (620, 1260) is formed so that gel (810) used to protect components (720) in the cavity does not come in contact with a lid (910) covering the cavity or the junction between the lid and the package attachment region. The gel reservoir (620, 1260) is used in conjunction with a formed level setting feature (630, 1250) that controls the height of gel in the cavity. Benefits include decreased volume of the cavity, thereby decreasing an amount of gel-fill needed and thus reducing production cost of the package.</p> |
