Method of radiatively grooving a semiconductor substrate

摘要

A method of radiatively scribing a substantially planar semiconductor substrate using a laser scribing apparatus, uses a laser scribing head configured and arranged to produce a two-dimensional array of laser beam spots to effect the scribing. In an embodiment, the spots of the array extend substantially parallel to X and Y directions in the plane of the substrate. In an embodiment, spots at a periphery in one or both directions of the array have a lower intensity than laser beams in a central portion of the array.

主权项

1. A method of radiatively scribing a substantially planar semiconductor substrate using a laser scribing apparatus, whereby a non-penetrative groove is formed along a scribeline that extends between opposing rows of semiconductor devices on a target surface of the substrate, whereby a Cartesian coordinate system XYZ can be defined in which: Said target surface lies in the XY plane; Said groove extends parallel to the Y direction, with a width in the X direction; the method comprising: clamping the substrate on a movable substrate holder of the laser scribing apparatus such that the target surface is positioned to be targeted by a laser scribing head of the laser scribing apparatus; relatively moving said substrate holder and said scribing head, so as to cause laser radiation from the head to translate along a course of said scribeline, such that, when viewed in said XY plane, the laser scribing head produces a two-dimensional array of laser beam spots to form the groove.