发明名称 Electronic level device and level staff used for electronic level device
摘要 An electronic level includes a wide-angle lens system having a two-dimensional imaging element configured to form thereon a picture image including an image of a level staff assigned with a code pattern, an extraction part configured to extract the image of the level staff from the picture image, a height-level measurement value calculation part configured to obtain a height-level measurement value indicated by a portion of the code pattern in the image of the level staff extracted by the extraction part, the portion of the code pattern located at a collimation optical axis of the wide-angle lens system, and a calculation part configured to calculate a collimation height from the height-level measurement value.
申请公布号 US9121698(B2) 申请公布日期 2015.09.01
申请号 US201213348538 申请日期 2012.01.11
申请人 Kabushiki Kaisha TOPCON 发明人 Kumagai Kaoru;Chiba Minoru;Abe Jun
分类号 G01C5/00;G01C9/00;G01C15/06 主分类号 G01C5/00
代理机构 Studebaker & Brackett PC 代理人 Studebaker & Brackett PC
主权项 1. An electronic level comprising: a plurality of level staffs respectively of which are assigned with identifiable code patterns allowing measurement of height levels and respectively indicating height levels different from each other, and respectively of which are provided in positions different from each other; a wide-angle lens system having a two-dimensional imaging element configured to form thereon a picture image including images respectively of the plurality of level staffs which are provided in the positions different from each other; an extraction part configured to extract the images of the plurality of level staffs from the picture image; a height-level measurement value calculation part configured to obtain a height-level measurement value indicated by a portion of the code pattern in each of the images of the plurality of level staffs extracted by the extraction part, the portion of the code pattern located at a collimation optical axis of the wide-angle lens system; and a collimation height calculation part configured to obtain actual collimation heights of the respective level staffs by obtaining offset values used to obtain the actual collimation heights of the level staffs respectively from the height-level measurement values obtained by the height-level measurement value calculation part, and by subtracting the offset values respectively from the height-level measurement values obtained by the height-level measurement value calculation part.
地址 Tokyo JP