发明名称 Dense oxide coated component of a plasma processing chamber and method of manufacture thereof
摘要 A method of forming a dense oxide coating on an aluminum component of semiconductor processing equipment comprises cold spraying a layer of pure aluminum on a surface of the aluminum component to a predetermined thickness. A dense oxide coating is then formed on the layer of pure aluminum using a plasma electrolytic oxidation process, wherein the plasma electrolytic oxidation process causes the layer of pure aluminum to undergo microplasmic discharges, thus forming the dense oxide coating on the layer of pure aluminum on the surface of the aluminum component.
申请公布号 US9123651(B2) 申请公布日期 2015.09.01
申请号 US201313851605 申请日期 2013.03.27
申请人 LAM RESEARCH CORPORATION 发明人 Shih Hong;Xu Lin;Kerns John Michael;Charles William;Daugherty John;Ramanathan Sivakami;Ormond Russell;O'Neill Robert G.;Stevenson Tom
分类号 H01L21/3065;H01L21/02;C25D11/02;C23C16/44 主分类号 H01L21/3065
代理机构 Buchanan, Ingersoll & Rooney PC 代理人 Buchanan, Ingersoll & Rooney PC
主权项 1. An aluminum component of semiconductor processing equipment comprising: a pure aluminum layer on a surface of the aluminum component of the semiconductor processing equipment; and a dense oxide coating on the pure aluminum layer wherein the dense oxide coating has been formed using plasma electrolytic oxidation, and wherein the plasma electrolytic oxidation causes the pure aluminum layer to undergo microplasmic discharge forming the dense oxide coating on the aluminum component; wherein the pure aluminum layer has a thickness of about 0.05 to 3 mm and the dense oxide coating has a thickness between about 0.02 to 0.2 mm.
地址 Fremont CA US