Wireless IC device

摘要

A wireless IC device includes a substantially rectangular parallelepiped dielectric body, a metal pattern that is provided on the surface of the dielectric body via a film and functions as a radiator, and a wireless IC element coupled to feeding portions of the metal pattern. The dielectric body has a laminated structure including a folded flexible dielectric layer. Surfaces of the dielectric layer which face each other after the dielectric layer has been folded are non-bonded surfaces.

主权项

1. A product comprising:
a body including a curved metal surface; and a wireless IC device attached to the curved metal surface; wherein the wireless IC device includes:
a dielectric body including an upper surface and a lower surface;a radiator provided on the dielectric body; anda wireless IC element coupled to a feeding portion of the radiator; the radiator is a metal pattern that is flexible; the metal pattern extends from the upper surface of the dielectric body to the lower surface of the dielectric body; the dielectric body has a laminated structure including a plurality of dielectric layers that are flexible, and adjacent ones of the plurality of dielectric layers in a lamination direction include non-bonded surfaces that slide relative to one another when the dielectric body is bent; and the radiator is bonded to the upper surface of the dielectric body with no gap therebetween and to the lower surface of the dielectric body with no gap therebetween, the radiator is not bonded to a side surface of the dielectric body extending between the upper surface and the lower surface, and a gap is provided between the radiator and the side surface of the dielectric body.