| 发明名称 | Image sensor | ||
| 摘要 | An image sensor includes a package having a window; a sensor chip facing the window, the sensor chip having a pixel region, the sensor chip having an electrode; a read-out circuit disposed farther from the window than the sensor chip, the read-out circuit having a read-out electrode connected to the electrode of the sensor chip; and a shielding plate disposed outside the pixel region of the sensor chip. The shielding plate is configured to block transmission of light. | ||
| 申请公布号 | US9123605(B2) | 申请公布日期 | 2015.09.01 |
| 申请号 | US201414296891 | 申请日期 | 2014.06.05 |
| 申请人 | SUMITOMO ELECTRIC INDUSTRIES, LTD. | 发明人 | Iguchi Yasuhiro;Inada Hiroshi;Migita Masaki |
| 分类号 | H01L27/146 | 主分类号 | H01L27/146 |
| 代理机构 | Smith, Gambrell & Russell LLP. | 代理人 | Smith, Gambrell & Russell LLP. |
| 主权项 | 1. An image sensor comprising: a package having a window; a sensor chip facing the window, the sensor chip having a pixel region; a read-out circuit disposed farther from the window than the sensor chip, the read-out circuit being electrically connected to the sensor chip; and a shielding plate disposed outside the pixel region of the sensor chip, wherein the shielding plate is configured to block transmission of light, and the shielding plate is inclined to be closer to a bottom of the package with increasing distance from the sensor chip, the bottom of the package being located at the opposite side of the window. | ||
| 地址 | Osaka JP | ||