Systems and methods for sensing signals communicated with a host device or on an interface of plug-in card when there is lack of access to sensing points

摘要

A circuit system for testing a chip is provided. The circuit system includes a first layer coupled with a plurality of ground communication mediums. Each ground communication medium facilitates communication of a ground signal. The circuit system includes a second layer coupled with a first integrated circuit chip. The second layer is coupled with a plurality of radio frequency (RF) communication mediums. The RF communication mediums facilitate communication of RF signals. The first integrated circuit chip communicates via one of the RF signals and the ground signal with a second integrated circuit chip. The first and second layers are used to probe the RF signals and the ground signal.

主权项

1. A circuit system comprising:
a plurality of layers including an insertion portion and an extension portion; a first layer of the plurality of layers, wherein the first layer is coupled with a first integrated circuit chip located in the insertion portion on top of the first layer, wherein the first integrated circuit chip is coupled to a second integrated circuit chip located on top of the first integrated circuit chip, the first layer having a plurality of traces in the extension portion of the first layer, wherein the traces are configured to transfer radio frequency (RF) signals; a second layer of the plurality of layers, wherein the second layer has a ground communication medium in the extension portion of the second layer, wherein the second layer is disposed below the first layer; a third layer disposed below the second layer; and a fourth layer disposed below the third layer, the fourth layer having a top side facing the third layer and a bottom side that is opposite the top side, the bottom side having a plurality of connector fingers in the insertion portion of the fourth layer for facilitating communication of a signal that is communicated between the second integrated circuit chip and a host controller located within a host device, a plurality of RF connectors disposed on the extension portion of the first layer, wherein the RF connectors are coupled to the traces, each of the RF connectors for coupling to an oscilloscope via a cable, wherein the insertion portion is configured to be inserted into the host device and the extension portion is configured to extend from the host device to facilitate a transfer to the oscilloscope of one of the RF signals that is received via one of the traces and that is representative of the signal that is communicated between the second integrated circuit chip and the host controller located within the host device.