发明名称 Apparatus for wafer grinding
摘要 A grinding wheel comprises an outer base with a first attached grain pad; and an inner frame with a second attached grain pad; and a spindle axis shared by the outer base and the inner frame, wherein at least one of the outer base and the inner frame can move independently along the shared spindle axis; and wherein the outer base, the inner frame, and the shared spindle axis all have a same center. A grinding system comprises an above said grinding wheel, and a wheel head attached to the shared spindle axis, capable of moving vertically, in addition to a motor driving the grinding wheel to spin; and a chuck table for fixing a wafer on top of the chuck table; wherein the grinding wheel overlaps a portion of the chuck table, each capable of spinning to the opposite direction of another.
申请公布号 US9120194(B2) 申请公布日期 2015.09.01
申请号 US201113188028 申请日期 2011.07.21
申请人 Taiwan Semiconductor Manufacturing Company, Ltd. 发明人 Wei Kuo-Hsiu;Chen Kei-Wei;Wang Ying-Lang;Kuo Chun-Ting
分类号 B24B7/22;B24D7/14 主分类号 B24B7/22
代理机构 Slater & Matsil, L.L.P. 代理人 Slater & Matsil, L.L.P.
主权项 1. A grinding system comprising: a grinding wheel comprising: an outer base configured to detachably receive a first grain pad; an inner frame encompassed within the outer base, and configured to detachably receive a second grain pad; a spindle axis shared by the outer base and the inner frame, wherein at least one of the outer base and the inner frame can move independently along the shared spindle axis; a control module configured to control movement of at least one of the outer base and the inner frame along the shared spindle axis; wherein the outer base, the inner frame, and the shared spindle axis all have a same center of rotation; a wheel head attached to the shared spindle axis of the outer base and the inner frame of the grinding wheel, capable of moving vertically; a motor configured to drive the grinding wheel to spin; and a chuck table configured to receive a wafer thereon; wherein the grinding wheel overlaps a portion of the chuck table, wherein the grinding wheel is configured to rotate in a first direction and the chuck table is configured to rotate in a second direction opposite the first direction, and wherein the chuck table and the spindle axis are configured to be tiltable relative one another.
地址 Hsin-Chu TW