装设了辅助电池的电路晶片及其制造方法;SECONDARY BATTERY-MOUNTED CIRCUIT CHIP AND MANUFACTURING METHOD THEREOF

摘要

一种装设了辅助电池的电路晶片及其制造方法被提供，在该电路晶片中一辅助电池被直接制造于一被形成的电路的一反面上而成为该辅助电池和该电路的一整合的结构。;一装设了辅助电池的电路晶片被建构成使得一辅助电池被直接制造在一个和一电路相对应的区域内而成为该辅助电池和该电路的一整合的结构。该晶片是一装设了辅助电池的电路晶片，在该晶片中该辅助电池被形成在一个和一被制造在一晶圆上的电路区域相反的表面上。该辅助电池和该电路藉由将该电路之具有多层式配线(multilayer wiring)的最上面部分形成为一在该电路表面之接受钝化处理的上部上的辅助电池结构、藉由将该电路的该多层式配线部分的最上面的配线层作在一将被共用的表面结构内来将该辅助电池形成为被直接堆叠、或将该辅助电池形成在其上形成有该电路的基材的背面上而被形成为一整合式结构。;A secondary battery-mounted circuit chip is configured such that a secondary battery is directly fabricated in a region corresponding to a circuit into an integrated structure of the secondary battery and the circuit. The chip is a secondary battery-mounted circuit chip in which the secondary battery is formed on a surface opposing a circuit region fabricated on a wafer. The secondary battery and the circuit are formed into the integrated structure by forming the uppermost part of the circuit having multilayer wiring into a secondary battery structure on the upper part of the circuit surface subjected to passivation, forming the secondary battery directly stacked by making the uppermost wiring layer of the multilayer wiring part of the circuit in a surface structure to be used in common, or forming the secondary battery on the rear surface of the substrate having the circuit formed thereon.