| 摘要 |
<p>THE INVENTION RELATES TO A CHIP CARD AND A METHOD FOR PRODUCING A CHIP CARD (41) WITH A CHIP MODULE THAT IS CONTACTED WITH AN EXTERNAL CONTACT ARRANGEMENT (31) ARRANGED IN THE CONTACT SURFACE (51) OF A CARD BODY, AS WELL AS WITH AN ANTENNA DEVICE ARRANGED IN A CARD INLAY (11), WHEREIN THE CARD INLAY IS INITIALLY PRODUCED IN A FIRST PRODUCTION DEVICE AND THE CARD INLAY IS SUBSEQUENTLY PROVIDED WITH AT LEAST ONE RESPECTIVE EXTERNAL LAYER (45, 46; 47, 48) ON BOTH SIDES IN A SECOND PRODUCTION DEVICE, NAMELY IN SUCH A WAY THAT THE EXTERNAL CONTACT ARRANGEMENT (31) ARRANGED ON THE EXTERNAL CONTACT SIDE OF THE CHIP CARRIER IS INTRODUCED INTO A RECESS OF THE ASSIGNED EXTERNAL LAYER, AND WHEREIN A CONNECTION BETWEEN THE CARD INLAY AND THE EXTERNAL LAYERS IS SUBSEQUENTLY PRODUCED IN A LAMINATING PROCESS.</p> |
