发明名称 |
STRONG LIGHT LIGHT-EMITTING DIODE (LED) LIGHT SOURCE MODULE AND PRODUCTION PROCESS THEREOF |
摘要 |
A production process of a strong light LED light source module, including the following steps: Step a: prepare an integral LED chip, and on a non-electrode surface having a large size in the LED chip, coat a film having a high refractive index; Step b: cut the LED chip coated with the film having a high refractive index into individual LED chips as required; Step c: fix the individual LED chips on the surface of a substrate, wherein a surface coated with the film having a high refractive index is in contact with the substrate and the individual LED chips are connected through welding wires; Step d: coat a film having a high refractive index on five remaining surfaces of the individual LED chips; Step e: assemble or encapsulate a compete LED light source module as required. |
申请公布号 |
US2015241002(A1) |
申请公布日期 |
2015.08.27 |
申请号 |
US201414272875 |
申请日期 |
2014.05.08 |
申请人 |
Dongguan Meisheng Electrical Products, Co., Ltd. |
发明人 |
CHENG HSIANG-YI |
分类号 |
F21K99/00;F21V23/00 |
主分类号 |
F21K99/00 |
代理机构 |
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代理人 |
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主权项 |
1. A production process of a strong light Light-Emitting Diode (LED) light source module, comprising the following steps:
step a: preparing an integral LED chip, and on a non-electrode surface having a large size in the LED chip, coating a film having a high refractive index; step b: cutting the LED chip coated with the film having a high refractive index into individual LED chips as required; step c: fixing the individual LED chips on the surface of a substrate, wherein a surface coated with the film having a high refractive index is in contact with the substrate and the individual LED chips are connected through welding wires; step d: coating a film having a high refractive index on five remaining surfaces of the individual LED chips; and step e: assembling or encapsulating a compete LED light source module as required. |
地址 |
Dongguan City CN |