| 摘要 |
A foam brush that has nodules on an outer diameter surface of the brush that have a pitch to diameter ratio (P/D) of between 1.2 and 1.5 and a nodule height to nodule diameter ratio of 0.2 to 0.5 can be used to achieve improved small particle and organic residue removal from substrates following CMP processing. CMP cleaning brushes of the disclosure may also be prepared with foams that are relatively soft and have a compression strength of less than 90 grams/cm2. CMP cleaning brushes with such P/D and H/D ratios, and optionally a compression strength of less than 90 grams/cm2 can be used in a variety of CMP cleaning processes including post copper CMP processes. |
