DEVICE AND METHOD FOR MAKING DIMENSIONAL MEASUREMENTS ON MULTILAYER OBJECTS SUCH AS WAFERS

摘要

An imaging device is provided for localizing structures through the surface of an object such as a wafer, with a view to positioning a measuring sensor relative to the structures, includes: (i) an imaging sensor; (ii) an optical imager able to produce, on the imaging sensor, an image of the object in a field of view; and (iii) an illuminator for generating an illuminating beam and lighting the field of view in reflection, in which the illuminating beam and lighting the field of view in reflection, in which the illuminator is able to generate an illuminating beam the spectral content of which is adapted to the nature of the object, such that the light of the beam is able to essentially penetrate into the object. Also provided is a system and a method for carrying out dimensional measurements on an object such as a wafer.

主权项

1. An imaging device for locating structures through the surface of an object such as a wafer, in order to position a measuring sensor relative to said structures, comprising:
an imaging sensor; optical imaging means capable of producing, on said imaging sensor, an image of the object in a field of view; illuminating means for generating an illuminating beam and lighting said field of view in reflection; andthe illuminating means are capable of generating an illuminating beam the spectral content of which is suited to the nature of the object, so that the light of said beam is capable essentially of penetrating into said object.