| 摘要 |
A method for manufacturing a semiconductor device having a wire loop by which a first bond point and a second bond point are connected comprises: raising a bonding tool (40) while paying out a wire (42), and moving the bonding tool in a direction from the second bond point toward the first bond point to form a portion to be cut (92) bent in the vicinity of the second bond point of the wire (42) extending from the leading end of the bonding tool (40); lowering the bonding tool (40) and moving the bonding tool to the portion to be cut (92) of the wire while pressing the leading end of the bonding tool (40) against the wire; thinning the portion to be cut (92) of the wire by vertically lowering the bonding tool (40) toward the second bond point and pressurizing the bonding tool; raising the bonding tool (40) while paying out the wire (42); and forming a wire tail (43) at the leading end of the bonding tool (40) by moving the bonding tool (40) in a direction away from the first bond point and the second bond point and along a wire direction connecting the first bond point and the second bond point, and cutting the wire at the portion to be cut (92). Consequently, the length of the wire tail can be easily and efficiently adjusted to a fixed value. |
