| 主权项 |
1. An inter-stage test structure for a wireless communication apparatus, the wireless communication apparatus having a unit under test (UUT), a first ground wire, a signal wire, a second ground wire, and a next-stage component, the UUT electrically connected to the next-stage component through the first ground wire, the signal wire, and the second ground wire, respectively, the inter-stage test structure comprising:
an upper board; a lower board having a first ground pad, a first signal pad, and a second ground pad disposed thereon, the first ground pad electrically connected a first ground terminal of the UUT to a first ground terminal of the next-stage component through the first ground wire, the first signal pad electrically connected to a signal terminal of the UUT and a signal terminal of the next-stage component through the signal wire, and the second ground pad electrically connected a second ground terminal of the UUT and a second ground terminal of the next-stage component; and an intermediate layer disposed between the upper board and the lower board, the intermediate layer having a first region and a second region defined thereon, the first region being in adjacent to the second region; wherein the first region has an air cavity formed between the intermediate layer and the lower board, and air inside the air cavity generates an air impedance; wherein, the second region has an impedance adjusting cavity formed between the intermediate layer and the lower board, and the impedance adjusting cavity comprises of a conductive paste, a ground plate, a substrate layer, and a metal plate; wherein the conductive paste being disposed on the lower board is configured to electrically connect the first ground pad to the second ground pad and the ground plate, the conductive paste has the ground plate, the substrate layer, and the metal plate sequentially disposed thereon, and the substrate layer has a predefined thickness for generating an adjustable impedance. |
