| 发明名称 |
APPARATUS FOR LIQUID TREATMENT OF WAFER SHAPED ARTICLES |
| 摘要 |
An apparatus for processing wafer-shaped articles comprises a spin chuck adapted to hold and spin a wafer-shaped article of a predetermined diameter during a processing operation. A liquid collector surrounds the spin chuck, and comprises a first inner surface. The first inner surface comprises a first conductive material. The collector further comprises a first conductive pathway for grounding the first conductive material. |
| 申请公布号 |
US2015243543(A1) |
申请公布日期 |
2015.08.27 |
| 申请号 |
US201414188230 |
申请日期 |
2014.02.24 |
| 申请人 |
LAM RESEARCH AG |
发明人 |
SCHWARZENBACHER Reinhold;PLISKA Milan |
| 分类号 |
H01L21/687;H01L21/67 |
主分类号 |
H01L21/687 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. Apparatus for processing wafer-shaped articles, comprising a spin chuck adapted to hold and spin a wafer-shaped article of a predetermined diameter during a processing operation to be performed on the wafer-shaped article, and a liquid collector surrounding said spin chuck, said liquid collector comprising a first inner surface, wherein said first inner surface comprises a first conductive material and wherein said collector further comprises a first conductive pathway for grounding said first conductive material. |
| 地址 |
Villach AT |
