DELAMINATION METHOD, DELAMINATION DEVICE, AND DELAMINATION SYSTEM

摘要

A delamination method for delaminating a laminated substrate which includes a first and a second substrates bonded to each other, includes: adjusting a position of the laminated substrate at a holding unit by a position adjusting unit and disposing the holding unit at a predetermined height position; disposing a sharp member of a delamination inducing unit at a predetermined height position; detecting a contact of the sharp member by bringing the sharp member into contact with a side surface of one end portion of the laminated substrate; inserting the sharp member into the side surface of the one end portion of the laminated substrate; and delaminating the second substrate from the first substrate by a plurality of suction movement units which sucks the second substrate of the laminated substrate to move the second substrate away from the first substrate.

主权项

1. A delamination method for delaminating a laminated substrate which includes a first substrate and a second substrate bonded to each other, comprising:
adjusting, in a holding unit configured to hold the first substrate of the laminated substrate, a position of the laminated substrate held by the holding unit by a position adjusting unit and then disposing the holding unit at a predetermined height position; disposing a sharp member of a delamination inducing unit at a predetermined height position, in the delamination inducing unit configured to form a delamination start part, in which the first substrate and the second substrate begin to be delaminated from each other, on a side surface of one end portion of the laminated substrate; detecting a contact of the sharp member by bringing the sharp member into contact with the side surface of the one end portion of the laminated substrate; inserting the sharp member into the side surface of the one end portion of the laminated substrate to form the delamination start part on the one end portion of the laminated substrate; and delaminating the second substrate from the first substrate by a plurality of suction movement units which sucks the second substrate of the laminated substrate and moves the second substrate away from the first substrate, such that delamination proceeds from the one end portion of the laminated substrate toward the other end portion thereof using the delamination start part as a starting point.