| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light emitting element for flip chip mounting which reduces light leaked from a peripheral part of an electrode surface with a simple method. <P>SOLUTION: Metal films 11, 12, serving as light shielding members, are disposed on a street line 23 which exists around a sapphire substrate 17 and serves as a margin for cutting when an LED element 10 is cut out from a wafer 31. Each of the metal films 11, 12 is divided into 4 sections by slits 18. Further, the metal films 11, 12 are made of a material equivalent to a metal film 22 which serves as an under-bump metal layer of p side and n side protruding electrodes 13, 14. <P>COPYRIGHT: (C)2013,JPO&INPIT |
