| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for efficiently mounting a plurality of semiconductors on a substrate without damaging the semiconductors. <P>SOLUTION: A method for manufacturing a semiconductor device by transferring a semiconductor layer formed on a first substrate via a sacrificial layer to a second substrate includes the steps of: bonding a second adhesive surface of a double-sided adhesive material in which a substrate for transfer is bonded to a first adhesive surface onto the semiconductor layer; separating the semiconductor layer bonded to the double-sided adhesive material from the first substrate by removing the sacrificial layer by performing etching and bonding the separated semiconductor layer to the second substrate via an adhesive agent; and separating the substrate for transfer from the double-sided adhesive material and then peeling the double-sided adhesive material from the semiconductor layer. An adhesive power on the first adhesive surface is smaller than an adhesive power on the second adhesive surface. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
