| 摘要 |
<p>A pressure sensing device with a sensor arrangement includes a first pressure sensor, at least a second pressure sensor and a support. Each sensor is substantially identical and surface-mounted onto the support. The sensor arrangement is embedded in an encapsulating package, wherein the encapsulating package is provided with at least a first opening channel that is in communication with a sensing area of the first pressure sensor. The pressure sensing device further includes a covering connector mounted over the encapsulating package, the covering connector comprising at least a first nozzle, arranged, when mounted, at a position corresponding with a surface position of the first opening channel on the package, to have a fluidic communication between the first nozzle and the first opening channel in the encapsulating package.</p> |
