Semiconductor package having a plurality of input/output members

摘要

Methods and apparatus for a semiconductor package having a plurality of input/output members are disclosed and may include a first laminate circuit board; with electrically conductive patterns formed thereon; a first semiconductor die coupled to the conductive patterns; a second laminate circuit board with electrically conductive patterns formed thereon; a second semiconductor die coupled to the conductive patterns and to the first semiconductor die; a flexible circuit board coupling the first and second laminate circuit boards; and contacts coupled to a bottom surface of the first laminate circuit board. The first and second laminate circuit boards each may comprise an insulative layer where the electrically conductive patterns are formed on one side of the insulative layer; a plating layer formed on predetermined parts of the electrically conductive patterns; and a protective layer formed on the electrically conductive patterns not covered by the plating layer.

主权项

1. A semiconductor package comprising:
a first laminate circuit board; a first plurality of electrically conductive patterns formed on the first laminate circuit board; a first semiconductor die coupled to the first plurality of electrically conductive patterns; a second laminate circuit board; a second plurality of electrically conductive patterns formed on the second laminate circuit board; a second semiconductor die coupled to the second plurality of conductive patterns; a flexible circuit board coupling the first laminate circuit board to the second laminate circuit board; and a plurality of contacts coupled to a bottom surface of the first laminate circuit board, wherein the first semiconductor die and the second semiconductor die are physically coupled to each other via at least one intervening layer.